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"IEEE Sensors Alert" is a pilot project of the IEEE Sensors Council. Started as one of its new initiatives, this weekly digest publishes teasers and condensed versions of our journal papers in layperson's language.
Articles Posted in the Month (Nov 2020)
Fire Sensing Technologies: A Review
Author: Authors: Anshul Gaur, Abhishek Singh, Ashok Kumar, Kishor S. Kulkarni, Sayantani Lala, Kamal Kapoor, Vishal Srivastava, Anuj Kumar, and Subhas Chandra Mukhopadhyay
Published in: IEEE Sensors Journal (Volume: 19, Issue: 9, May 2019)
The progress on fire sensing technologies has been quite substantial due to advancements in sensing, information, and communications technologies. The sensing system’s hardware and algorithm ensure its excellent ability to detect early fire with less false positives. The information and communication technology focuses on issuing an early warning to notify the occupants and the fire department. Developing a robust fire system demands establishing the benchmark parameters for heat, flame, smoke, and gas levels detection in every fire scenario.
Sensing as a Service: Challenges, Solutions and Future Directions
Author: Xiang Sheng, Jian Tang, Xuejie Xiao and Guoliang Xue.
Published in: IEEE Sensors Journal (Volume: 13, Issue: 10, October 2013)
Mobile phones do have various sensors which are used for exciting sensing applications by creating a cloud computing platform. This could be used as crowd-sourced platform to create innumerable novel sensing applications which are energy-efficient too.
Early detection of plant diseases can prevent crop failure. The Leaf wetness duration (LWD) that leads to fungal infections is a major concern among farmers. Using LWD as a parameter, researchers developed disease detection models with an Internet of Things (IoT)-enabled leaf wetness sensor (LWS) prototype fabricated on flexible substrates. Researchers tested the prototypes on medicinal plants. The prototype made comparatively accurate, precise, and early disease predictions.
The integrated circuits are known for high circuit densities that raise concerns for thermal, mechanical and low-cost packaging material induced stresses. All these put together either cause the chip to fail or perform against the design. Study of such stresses is mandatory before rolling out the chips from a Fab lab. Silicon Piezoresistive Stress Sensors have shown great potential for understanding and detecting stress distributions in electronic packages. It eventually helps in calibrating the IC parameters, selecting wafer planes and packaging materials, etc.
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